FREE PHYSICAL SEMINAR: 10th MARCH 2023
Thermal characterization of complex electronics:
A basic primer on structure functions
With the technological development of semiconductor components, the chip size is getting smaller and smaller, and the chip design is also developing from single-core to multi-core. The engineers can no longer solve the temperature problem simply by external heat dissipation due to the higher power density.
In this physical seminar, we will explore the electronics thermal simulation analysis combined with physical testing the ability to accurately and efficiently test, measure and thermally characterize semiconductor integrated circuit packages, single and arrayed LEDs, stacked and multi-die packages, power electronics modules, thermal interface material (TIM) properties, and complete electronic systems.
During this FREE Physical Seminar, you will learn:
Thermal simulation and test solutions for electronics and semiconductors
Principles of Semiconductor package thermal characterization
Thermal metric reliability quality
AGENDA:
09:00 AM - 09:30 AM: Registration & Coffee/Tea
09:30 AM – 09:35 AM: Siemens overall introduction
09:35 AM - 09:45 AM: AscendTech/ETS Solutions overall introduction
09:45 AM – 10:25 AM: Introduction to Siemens thermal simulation and test solutions for electronics and semiconductors
10:25 AM – 11:00 AM: Principles of Semiconductor package thermal characterization, thermal metric reliability quality
11:00 AM – 11:30 AM: Q & A
11:30 AM – 12:30 PM: Lunch & Networking
LOCATION:
Siemens Industry Software Pte Ltd
Address: The Siemens Center,
60 Macpherson Road, Singapore 348615
E-mail: marketing@ascend-tech.com
Telephone: +65 6340 1040
COST: FREE
limited seats available.
The latest date for registration: 3rd March 2023
Register to join the seminar